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Model MPKOSFP1 ( packaging plastic box for 1-count OSFP transceiver )
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Model MPKOSFP1 ( clamshell box for 1-count OSFP transceivers )
Specification plastic box clamshell packaging for 1-count OSFP Transceiver
Details about the carton Model MPKOSFP1= 1 carton = ? pieces = ? x ? x ? cm = ? cubic feet = dimensions weight ? KGS

 

 

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OSFP: Redefining High-Speed Networking
OSFP:重新定义高速网络
OSFP:重新定義高速網絡

OSFP has marked the beginning of a new era in high-speed networking, data centers, and telecommunications. The more prominent form factor of OSFPs enables superior thermal performance,
allowing these transceivers to handle bandwidth-intensive applications without the risk of overheating. Importantly, their forward compatibility potential prepare the industry for future applications demanding up to 800G rates.

OSFP 标志着高速网络、数据中心和电信新时代的开始,其卓越的外形尺寸提供了出色的散热性能,使这些收发器能够处理大带宽应用,
而不会有过热的风险。重要的是,这些收发器具有向前兼容的潜力,为业界未来速度高达 800G 的应用做好了准备

OSFP 標誌著高速網絡、資料中心和電信新時代的開始。OSFP 優越的體型尺寸提供了出色的散熱效能,使這些收發器能處理大量帶寬的應用,
而不會面臨過熱的風險。重要的是,它們具有前向兼容的潛力,為業界未來高達 800G 速度的應用做好了準備。

Differences in Design: QSFP-DD vs. OSFP
QSFP-DD 和 OSFP 有什么区别?
QSFP-DD與OSFP有何差異?
Both QSFP-DD and OSFP modules support up to 400 Gbps. However, OSFP, with its superior thermal performance and larger size, is better equipped for high-performance applications.
With the introduction of OSFP1600 and OSFP-XD, the potential of OSFP is further accentuated. Specifically, OSFP-XD offers double the front panel density compared to QSFP-DD.
With the continuous advancements of transceivers, they are not only reshaping current practices but also pioneering future possibilities, holding promising potential in shaping the future of the infrastructure of the digital realm.

QSFP-DD 和 OSFP 模块都支持高达 400 Gbps 的速度。不过,OSFP 具有更好的散热性能和更大的尺寸,因此更适合高性能应用。随着 OSFP1600 和 OSFP-XD 的推出,
OSFP 的潜力得到了进一步展示。与 QSFP-DD 相比,OSFP-XD 将前面板密度提高了一倍。随着收发器技术的不断发展,它们不仅塑造了当前的实践,
还为未来开辟了无限可能,具有塑造未来数字基础设施的巨大潜力。

QSFP-DD 和 OSFP 模組都支持高達 400 Gbps 的速度。但是,OSFP 有著更佳的散熱性能和較大的尺寸,更適合於高效能應用。 隨著 OSFP1600 和 OSFP-XD 的推出,
OSFP 的潛力進一步展現。與 QSFP-DD 相比,OSFP-XD 的前面板密度增加了一倍。 隨著收發器技術的不斷進化,它們不僅塑造了當前的實踐,也為未來開創了無限可能性,
對形塑未來的數字基礎設施有著巨大的潛力。

Relative size comparison of OSFP-XD OSFP and QSFP-DD modules

 

Q:什麼是 OSFP(八進位小型可插拔介面)?
答:OSFP 是一種新型可插拔外形,具有八個高速電氣通道,最初將支援 400 Gbps(8x50G)。它比 QSFP 稍寬且更深,但每 1U 前面板仍支援 36 個 OSFP 端口,每 1U 可實現 14.4 Tbps。

Q:為什麼要採用新的光學模組外形尺寸?
答:400G 光纖比 100G 光纖需要更多的功率,而且許多 400G 光纖不適合現有的 QSFP 外形尺寸。根據具體的 400G 光學技術,初始功率預測範圍從 7.5 瓦到 15 瓦。

Q:OSFP 如何滿足這項散熱要求?
答:OSFP 具有整合式散熱器,可大幅提高散熱性能,並可在具有傳統氣流的交換器機箱中支援功率高達 15W 的模組。

Q:與 QSFP 的向後相容性如何?
答:由於 OSFP 比 QSFP 稍寬且更深,因此可以在 OSFP 籠中建置支援現有 100G QSFP 光學模組的轉接器。

Q:前向相容性如何?
答:當這些系統和光學元件在未來面世時,OSFP 能夠滿足 800 Gbps 光學元件的預期熱要求。

Q:OSFP MSA 起什麼作用?
答:OSFP MSA 將定義 OSFP 規範,包括機械模組、卡籠、電氣介面、引腳排列和管理介面。

 

★What is the Difference Between Anti-Static, Dissipative, Conductive, and Insulative?
★防靜電、耗散、導電和絕緣有什麼區別?


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E-mails:
rfqmpk@gmail.com; barret-chen@memorypack.com.tw; superpolu@gmail.com; sales01@memorypack.com.tw;cherrylin.mpk@gmail.com

E-mails:
rfqmpk@gmail.com
barret-chen@memorypack.com.tw
superpolu@gmail.com
sales01@memorypack.com.tw
cherrylin.mpk@gmail.com

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What are transceivers?

A transceiver in simple terms can be defined as a device that comprises of both a transmitter and a receiver of analog or digital signals.
Radios and telephones are some of the devices that use transceivers. Network transceivers are used in specific networks like LAN to transmit signals.
Lots of people tend to confuse transceivers and transponders ere is the difference; a transceiver transmits and receives signals anytime while a transponder
only responds to an incoming signal or command.

Transceivers come in three configurations; the chip, board and module style. The chip style is portable and the smallest optical transceiver available.
The board Style unlike the chip style, is in-built in the network system making it permanent while the module Styles are stand-alone devices as they
are not directly installed in the network system.

Modes of Channel operations

Fiber optic transceivers operate in three modes of channels; the simplex, half-duplex, and full-duplex modes.

1. The Simplex mode: This mode of channel operation is one way. It does not send back error information. Since it is one way,
    its use is phasing out and todayit is mainly used in radios.
2. Half-duplex mode: This can only handle a single signal at a time. That is; it can only transmit or receive a signal at a time. Not both.
3. Full-duplex mode: A full-duplex transceiver can handle the reception and transmission of all signals at once. One thing to note though
    is that the transmitter and receiver need to work on different frequencies in order to avoid collisions between transmitted and reception signals.
    Some of the types of Transceivers we offer

GBIC: GBIC (Gigabit Interface Converter) is the media conversion device that connects Gigabit network equipment and fiber optic networks. By use of a GBIC transceiver,
Gigabit network equipment can connect to single mode ports, multimode fiber ports and even copper wires. GBIC is also hot pluggable which enables connection modifications.

SFP: SFP in full is Small Form- factor Pluggable. They are also referred to as mini GBIC due to their similarity in function to the GBIC transceivers though smaller in size.
SFP transceivers are mainly used to link equipment in telecom and data communications like switches and routers. They support applications like Fiber-to-the-desktop (FTTD),
SONET/SDH Network, Gigabit Ethernet, and High-speed computer links among others.

SFP Plus (SFP+): These are an upgraded version of the SFP. The only difference is that they can support up to 10Gbps data rates and are smaller than the 10Gbps X2 and
Xenpak transceivers.

XFP: These are protocol independent optical media conversion equipment used in the SONET/SDH Network, 10G Ethernet and Fiber channel applications. XFP transceivers
are currently the cheapest and the smallest transceivers.

XENPAK: These transceivers support all optical transceiver ports defined in the IEEE 802.3ae. Covering up to 10Km via a G652 multimode fiber he Xenpak transceivers
come in three types which include; Xenpak 10GB SR, Xenpak 10GB LR and the 40km Xenpak 10 GP ER.

X2: These function exactly like the Xenpak because they were built on the Xenpak standards. These optical transceivers?10G Ethernet standards were defined by IEEE in 2002.



Smart phone case / cover / shell
Manufacturing & design of PCB : For dram memory modules , For flash memory cards, For SSD (Solid State Disk) , For USB
Flash memory card microSD SD CF & accessories

  1. Flash memory card readers / adapters ( Micro SD /SDHC to SD/SDHC , Mini sd to sd adapter , Micro SD/SDHC to mini SD/SDHC , Micro SD to CF I , SD / SDHC / MMC to CF II reader adapter , All in 1 memory card reader / adapter , Micro sd to USB 2.0 reader / adapter , Micro SD & m2 to USB 2.0 reader / adapter , SDXC & SDHC to USB 2.0 reader / adapter , SD & SDHC to USB 2.0 reader / adapter , Micro SDXC & SDXC to USB 2.0 reader / adapter , USB 3.0 reader (support micro sdxc & sdxc) , micro sd to xD , SD / SDHC / MMC card to cardbus pc card reader / adapter, PCI to CardBus/PCMCIA PC Card Adapter + 3.5" Card Drive, CF (CompactFlash) to 2.5” SATA (Serial ATA) interface HDD )
  2. MicroSD SD CF Memory card packaging ( Memory card storage box , Memory card plastic box ( pure plastic blister clamshell box , envelope paper pack + internal plastic inserts , memory card mini cases / jewel boxes , memory card trays ), Memory card labels / stickers )
  3. Introduction of flash memory cards' brands ( Fujitsu memory card, Kingston dram memory module / flash memory cards )
  4. Memory card / USB duplicators

Dram module & accessories

  1. PCB for dram memory modules / flash memory cards / SSD / USB
  2. Dram memory module DDR packaging plastic box tray, dram memory module DDR heat sinks ( Long dimm, So dimm, VLP dimm, Mini dimm, VLP mini dimm, Micro dimm, Sun module, Apple FB dimm, 72 pin, cardboard box )
  3. heat spreaders

SSD (Solid State Drive) & accessories ( packaging and tray , adapters / converters )
Hard Disk Drive (HDD) and accessories ( 2.5" SSD / 2.5" HDD / 1.8" SSD / 1.8" HDD, 3.5" HDD)
CPU processor tray packaging and accessories (Plastic blister &Trays for CPU processor: Intel P3, Intel 478, Intel LGA 775 /like E5400, Intel LGA 1156/like G6950, Intel LGA 1366/like I7-930)
USB Flash Pen Driver Packaging (plastic box, tray)
ESD cardboard box
Plastic bags for battery, memory cards & others
‧Dram memory module converter / adaptors

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